What tests are generally required for electronic components?

1. Routine testing
Mainly test the appearance, size, electrical performance, safety performance, etc. of electronic components;
Test the basic parameters according to the specifications of the components, such as the transistor, to test the appearance, size, ICBO, VCEO, VCES, HFE, pin tension, pin bending, solderability, solder heat resistance, etc. Some export products also need Test RoHS.

2. Reliability test
Mainly test the life and environmental test of electronic components;

According to the requirements of the user and the requirements of the specification, the life of the device and various environmental tests, such as triodes, are tested for high temperature test, low temperature test, moisture test, vibration test, maximum load test, high temperature durability test, etc. ;

3. DPA analysis
Mainly control the internal structure and process of the device.

Such as triode, the main means are X-ray inspection internal structure, acoustic sweep monitoring internal structure and packaging process, unsealing monitoring internal wafer structure and size, etc. Among them, X-Ray real-time imaging technology is becoming more and more widely used. Because of its non-destructive, fast, easy to use, and relatively low cost, it is favored by more and more electronic product manufacturers. X-ray inspection can be used to check the internal status of components, such as chip arrangement, lead arrangement and lead frame design, solder balls (leads), etc. For components with complex structures, you can adjust the angle, voltage, current, and contrast and brightness of the X-ray tube to obtain effective image information.